| |
|
 |
|
|
|
 |
| |
- Knitted wiper
made from 100% continuous filament micro denier.
(High Shrinkage High Density Finish) |
 |
| |
- Ultrasonic cut&sealed
treatment for four edges completely prevent
scratches.
- Particle generation is very low.
- Absorbency is excellent.
- Laundered and double packaged in class 1 cleanrooms. |
 |
| |
- Used in class
1-10 cleanrooms.
- Ideal for ultra-high accumulation semiconductor process,
TFT LCD,
Sterilized room.
- Suited for equipment cleaning in critical manufacturing
operation |
 |
| |
|
|
|
|
Particle
Count(>0.5§/cft)
|
1.3 X 10©ù
|
|
Absorbency (%)
|
307
|
|
Capacity(§¢/§³)
|
655
|
|
Efficiency(§¢/g)
|
3.07
|
|
Time to
maxi. sorption(sec)
|
14
|
|
Non Volatile Residue(g/§³)
|
|
|
DI water
|
0.011
|
|
IPA
|
0.02
|
|
Extractables(PPM)
|
|
|
K
|
0.03
|
|
Fe
|
ND
|
|
Na
|
0.21
|
|
Cl
|
0.013
|
|
Ca
|
0.1
|
|
Mg
|
0.14
|
|
|
|
|
 |
|
|
|
 |
| |
- Knitted wiper
made from 100% continuous filament micro denier. |
 |
| |
- Ultrasonic cut&sealed
treatment for four edges completely prevent
scratches.
- Particle generation is very low.
- Absorbency is very excellent.
- Laundered and double packaged in class 1 cleanrooms. |
 |
| |
- Used in class
1-10 cleanrooms.
- Ideal for ultra-high accumulation semiconductor process,
TFT LCD,
Sterilized room.
- Suited for equipment cleaning in critical manufacturing
operation |
 |
| |
|
|
|
|
Particle
Count(>0.5§/cft)
|
3.6 X 10©ù
|
|
Absorbency (%)
|
300
|
|
Capacity(§¢/§³)
|
471
|
|
Efficiency(§¢/g)
|
3
|
|
Time to
sorption(sec)
|
56
|
|
Non Volatile Residue(g/§³)
|
|
|
DI water
|
0.014
|
|
IPA
|
0.025
|
|
Extractables(PPM/0.1m2)
|
|
|
K
|
0.06
|
|
Fe
|
ND
|
|
Na
|
0.23
|
|
Cl
|
0.023
|
|
Ca
|
0.14
|
|
Mg
|
0.24
|
|
|
|
|
|
|
 |
|
|
|
 |
| |
- woven wiper made
from 100% continuous filament micro denier. |
 |
| |
- Ultrasonic cut&sealed
treatment for four edges completely prevent
scratches.
- Particle generation is very low.
- Absorbency is very excellent.
- Sealed edges prevent particle or lint generation.
- Laundered and double packaged in class 1 cleanrooms. |
 |
| |
- Used in class
1-10 cleanrooms.
- Ideal for ultra-high accumulation semiconductor process,
TFT LCD,
Sterilized room.
- Suited for equipment cleaning in critical manufacturing
operation. |
 |
| |
|
|
|
|
Particle
Count(>0.5§/cft)
|
2.9 X 10©ù
|
|
Absorbency (%)
|
264
|
|
Capacity(§¢/§³)
|
348
|
|
Efficiency(§¢/g)
|
2.64
|
|
Time to
maxi. sorption(sec)
|
63
|
|
Non Volatile Residue(g/§³)
|
|
|
DI water
|
0.08
|
|
IPA
|
0.07
|
|
Extractables(PPM)
|
|
|
K
|
0.415
|
|
Fe
|
ND
|
|
Na
|
0.051
|
|
Cl
|
0.44
|
|
Ca
|
0.029
|
|
Mg
|
ND
|
|
|
|
|
|
|
 |
|
|
|
 |
| |
- Knitted wiper
made from 100% continuous filament micro denier. |
 |
| |
- Ultrasonic cut&sealed
treatment for four edges completely prevent
scratches.
- Particle generation is very low.
- Absorbency is very excellent.
- Laundered and double packaged in class 1 cleanrooms. |
 |
| |
- Used in class
1-10 cleanrooms.
- Ideal for ultra-high accumulation semiconductor process,
TFT LCD,
Sterilized room.
- Suited for equipment cleaning in critical manufacturing
operation. |
 |
| |
|
|
|
|
Particle
Count(>0.5§/cft)
|
4.1 X 10©ù
|
|
Absorbency (%)
|
257
|
|
Capacity(§¢/§³)
|
524
|
|
Efficiency(§¢/g)
|
2.57
|
|
Time to
maxi. sorption(sec)
|
102
|
|
Non Volatile Residue(g/§³)
|
|
|
DI water
|
0.07
|
|
IPA
|
0.143
|
|
Extractables(PPM)
|
|
|
K
|
0.415
|
|
Fe
|
ND
|
|
Na
|
0.056
|
|
Cl
|
0.32
|
|
Ca
|
0.035
|
|
Mg
|
0.28
|
|
|
|
|
|
|
 |
|
|
|
 |
| |
- Knitted wiper
made from 100% continuous filament micro denier. |
 |
| |
- Ultrasonic cut
& sealed treatment for four edges completely prevent
scratches.
- Particle generation is very low.
- Durable, soft and non-abrasive.
- Laundered and double packaged in class 1 cleanrooms. |
 |
| |
- Used in class
1-10 cleanrooms.
- Used for semiconductor process, optics aerospace applications.
- Suited for equipment cleaning in critical manufacturing
operation. |
 |
| |
|
|
|
|
Particle
Count(>0.5§/cft)
|
4.5 X 10©ù
|
|
Absorbency (%)
|
271
|
|
Capacity(§¢/§³)
|
582
|
|
Efficiency(§¢/g)
|
2.71
|
|
Time to
sorption(sec)
|
51
|
|
Non Volatile Residue(g/§³)
|
|
|
DI water
|
0.09
|
|
IPA
|
0.194
|
|
Extractables(PPM)
|
|
|
K
|
0.105
|
|
Fe
|
0.005
|
|
Na
|
0.695
|
|
Cl
|
0.065
|
|
Ca
|
0.4
|
|
Mg
|
ND
|
|
|
|
|
|
|
 |
|
|
|
 |
| |
- Knitted wiper
made from 100% continuous filament micro denier. |
 |
| |
- Ultrasonic cut&sealed
treatment for four edges completely prevent
scratches.
- Particle generation is very low.
- Absorbency is very excellent.
- Metallic ion and extractables are extremely low.
- Laundered and double packaged in class 1 cleanrooms. |
 |
| |
- Used in class
10 cleanrooms.
- Ideal for semiconductor,aerospace.
- Suited for equipment cleaning in critical manufacturing
operation. |
 |
| |
|
|
|
|
Particle
Count(>0.5§/cft)
|
3.7 X 10©ù
|
|
Absorbency (%)
|
227
|
|
Capacity(§¢/§³)
|
478
|
|
Efficiency(§¢/g)
|
2.27
|
|
Time to
maxi. sorption(sec)
|
39
|
|
Non Volatile Residue(g/§³)
|
|
|
DI water
|
0.03
|
|
IPA
|
0.04
|
|
Extractables(PPM)
|
|
|
K
|
0.065
|
|
Fe
|
0.005
|
|
Na
|
0.246
|
|
Cl
|
0.033
|
|
Ca
|
0.035
|
|
Mg
|
ND
|
|
|
|
|
|
|
 |
|
|
|
 |
| |
- Knitted wiper
made from 100% multifilaments PES fibers |
 |
| |
- Ultrasonic cut&sealed
treatment for four edges completely prevent
scratches.
- Particle generation is very low.
- Absorbency is excellent.
- Laundered and double packaged in class 1 cleanrooms. |
 |
| |
- Used in class
10-100 cleanrooms.
- Ideal for ultra-high accumulation semiconductor process,
TFT LCD,
Sterilized room.
- Suited for equipment cleaning in critical manufacturing
operation. |
 |
| |
|
|
|
|
Particle
Count(>0.5§/cft)
|
5.7 X 10©ù
|
|
Absorbency (%)
|
332
|
|
Capacity(§¢/§³)
|
476
|
|
Efficiency(§¢/g)
|
3.32
|
|
Time to
maxi. sorption(sec)
|
68
|
|
Non Volatile Residue(g/§³)
|
|
|
DI water
|
0.002
|
|
IPA
|
0.053
|
|
Extractables(PPM)
|
|
|
K
|
0.027
|
|
Fe
|
0.005
|
|
Na
|
0.28
|
|
Cl
|
0.17
|
|
Ca
|
0.205
|
|
Mg
|
0.3
|
|
|
|
|
|
|
 |
|
|
|
 |
| |
- Knitted wiper
made from 100% multifilaments PES fibers |
 |
| |
- Ultrasonic cut&sealed
treatment for four edges completely prevent
scratches.
- Particle generation is very low.
- Absorbency is excellent.
- Laundered and double packaged in class 1 cleanrooms. |
 |
| |
- Used in class
10-100 cleanrooms.
- Ideal for ultra-high accumulation semiconductor process,
TFT LCD,
Sterilized room.
- Suited for use in the most critical environments for
equipment cleaning |
 |
| |
|
|
|
|
Particle
Count(>0.5§/cft)
|
5.9 X 10©ù
|
|
Absorbency (%)
|
332
|
|
Capacity(§¢/§³)
|
569
|
|
Efficiency(§¢/g)
|
3.32
|
|
Time to
maxi. sorption(sec)
|
54
|
|
Non Volatile Residue(g/§³)
|
|
|
DI water
|
0.018
|
|
IPA
|
0.057
|
|
Extractables(PPM)
|
|
|
K
|
0.029
|
|
Fe
|
0.01
|
|
Na
|
0.111
|
|
Cl
|
0.05
|
|
Ca
|
0.073
|
|
Mg
|
ND
|
|
|
|
|
|
|
|
|