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  - Knitted wiper made from 100% continuous filament micro denier.
   (High Shrinkage High Density Finish)
  - Ultrasonic cut&sealed treatment for four edges completely prevent
   scratches.
- Particle generation is very low.
- Absorbency is excellent.
- Laundered and double packaged in class 1 cleanrooms.
  - Used in class 1-10 cleanrooms.
- Ideal for ultra-high accumulation semiconductor process, TFT LCD,
   Sterilized room.
- Suited for equipment cleaning in critical manufacturing operation
 
Particle Count(>0.5§­/cft)
1.3 X 10©ù
Absorbency (%)
307
Capacity(§¢/§³)
655
Efficiency(§¢/g)
3.07
Time to maxi. sorption(sec)
14
Non Volatile Residue(g/§³)
DI water
0.011
IPA
0.02
Extractables(PPM)
K
0.03
Fe
ND
Na
0.21
Cl
0.013
Ca
0.1
Mg
0.14

  - Knitted wiper made from 100% continuous filament micro denier.
  - Ultrasonic cut&sealed treatment for four edges completely prevent
   scratches.
- Particle generation is very low.
- Absorbency is very excellent.
- Laundered and double packaged in class 1 cleanrooms.
  - Used in class 1-10 cleanrooms.
- Ideal for ultra-high accumulation semiconductor process, TFT LCD,
   Sterilized room.
- Suited for equipment cleaning in critical manufacturing operation
 
Particle Count(>0.5§­/cft)
3.6 X 10©ù
Absorbency (%)
300
Capacity(§¢/§³)
471
Efficiency(§¢/g)
3
Time to sorption(sec)
56
Non Volatile Residue(g/§³)
DI water
0.014
IPA
0.025
Extractables(PPM/0.1m2)
K
0.06
Fe
ND
Na
0.23
Cl
0.023
Ca
0.14
Mg
0.24

  - woven wiper made from 100% continuous filament micro denier.
  - Ultrasonic cut&sealed treatment for four edges completely prevent
   scratches.
- Particle generation is very low.
- Absorbency is very excellent.
- Sealed edges prevent particle or lint generation.
- Laundered and double packaged in class 1 cleanrooms.
  - Used in class 1-10 cleanrooms.
- Ideal for ultra-high accumulation semiconductor process, TFT LCD,
   Sterilized room.
- Suited for equipment cleaning in critical manufacturing operation.
 
Particle Count(>0.5§­/cft)
2.9 X 10©ù
Absorbency (%)
264
Capacity(§¢/§³)
348
Efficiency(§¢/g)
2.64
Time to maxi. sorption(sec)
63
Non Volatile Residue(g/§³)
DI water
0.08
IPA
0.07
Extractables(PPM)
K
0.415
Fe
ND
Na
0.051
Cl
0.44
Ca
0.029
Mg
ND

  - Knitted wiper made from 100% continuous filament micro denier.
  - Ultrasonic cut&sealed treatment for four edges completely prevent
   scratches.
- Particle generation is very low.
- Absorbency is very excellent.
- Laundered and double packaged in class 1 cleanrooms.
  - Used in class 1-10 cleanrooms.
- Ideal for ultra-high accumulation semiconductor process, TFT LCD,
   Sterilized room.
- Suited for equipment cleaning in critical manufacturing operation.
 
Particle Count(>0.5§­/cft)
4.1 X 10©ù
Absorbency (%)
257
Capacity(§¢/§³)
524
Efficiency(§¢/g)
2.57
Time to maxi. sorption(sec)
102
Non Volatile Residue(g/§³)
DI water
0.07
IPA
0.143
Extractables(PPM)
K
0.415
Fe
ND
Na
0.056
Cl
0.32
Ca
0.035
Mg
0.28

  - Knitted wiper made from 100% continuous filament micro denier.
  - Ultrasonic cut & sealed treatment for four edges completely prevent
   scratches.
- Particle generation is very low.
- Durable, soft and non-abrasive.
- Laundered and double packaged in class 1 cleanrooms.
  - Used in class 1-10 cleanrooms.
- Used for semiconductor process, optics aerospace applications.
- Suited for equipment cleaning in critical manufacturing operation.
 
Particle Count(>0.5§­/cft)
4.5 X 10©ù
Absorbency (%)
271
Capacity(§¢/§³)
582
Efficiency(§¢/g)
2.71
Time to sorption(sec)
51
Non Volatile Residue(g/§³)
DI water
0.09
IPA
0.194
Extractables(PPM)
K
0.105
Fe
0.005
Na
0.695
Cl
0.065
Ca
0.4
Mg
ND

  - Knitted wiper made from 100% continuous filament micro denier.
  - Ultrasonic cut&sealed treatment for four edges completely prevent
   scratches.
- Particle generation is very low.
- Absorbency is very excellent.
- Metallic ion and extractables are extremely low.
- Laundered and double packaged in class 1 cleanrooms.
  - Used in class 10 cleanrooms.
- Ideal for semiconductor,aerospace.
- Suited for equipment cleaning in critical manufacturing operation.
 
Particle Count(>0.5§­/cft)
3.7 X 10©ù
Absorbency (%)
227
Capacity(§¢/§³)
478
Efficiency(§¢/g)
2.27
Time to maxi. sorption(sec)
39
Non Volatile Residue(g/§³)
DI water
0.03
IPA
0.04
Extractables(PPM)
K
0.065
Fe
0.005
Na
0.246
Cl
0.033
Ca
0.035
Mg
ND

  - Knitted wiper made from 100% multifilaments PES fibers
  - Ultrasonic cut&sealed treatment for four edges completely prevent
   scratches.
- Particle generation is very low.
- Absorbency is excellent.
- Laundered and double packaged in class 1 cleanrooms.
  - Used in class 10-100 cleanrooms.
- Ideal for ultra-high accumulation semiconductor process, TFT LCD,
   Sterilized room.
- Suited for equipment cleaning in critical manufacturing operation.
 
Particle Count(>0.5§­/cft)
5.7 X 10©ù
Absorbency (%)
332
Capacity(§¢/§³)
476
Efficiency(§¢/g)
3.32
Time to maxi. sorption(sec)
68
Non Volatile Residue(g/§³)
DI water
0.002
IPA
0.053
Extractables(PPM)
K
0.027
Fe
0.005
Na
0.28
Cl
0.17
Ca
0.205
Mg
0.3

  - Knitted wiper made from 100% multifilaments PES fibers
  - Ultrasonic cut&sealed treatment for four edges completely prevent
   scratches.
- Particle generation is very low.
- Absorbency is excellent.
- Laundered and double packaged in class 1 cleanrooms.
  - Used in class 10-100 cleanrooms.
- Ideal for ultra-high accumulation semiconductor process, TFT LCD,
   Sterilized room.
- Suited for use in the most critical environments for equipment cleaning
 
Particle Count(>0.5§­/cft)
5.9 X 10©ù
Absorbency (%)
332
Capacity(§¢/§³)
569
Efficiency(§¢/g)
3.32
Time to maxi. sorption(sec)
54
Non Volatile Residue(g/§³)
DI water
0.018
IPA
0.057
Extractables(PPM)
K
0.029
Fe
0.01
Na
0.111
Cl
0.05
Ca
0.073
Mg
ND